With a strong standalone identity and continued commitment to driving innovation, XSYS will showcase its wide range of solutions, which have been designed to reshape the future of label and packaging printing.
The company, formerly part of Flint Group, has announced its participation as a gold sponsor and exhibitor at Labelexpo Europe from 11–14 September 2023.
Labelexpo will serve as the ideal platform for XSYS to demonstrate its technologies, including the newly introduced nyloflex® FTV Digital plate for high-end flexible packaging, alongside other premium flexo products, such as the nyloflex® XVH and nyloflex® XAH thermal plates. With the choice to expose using either conventional tube lights or LED technology, the new nyloflex® FTV flexo plate offers platemakers and printers the best of both worlds helping to reduce complexity in the plate room while improving productivity. For the letterpress market, the company will show the nyloprint® WF Sharp water washable, film-based plate, which has been developed for high-end label production.
Visitors will be able to experience the ThermoFlexX TFxX 48 plate imager connected via a robotic interface to the new Catena-E 48 LED exposure unit, a powerful combination that represents a leap in efficiency and quality for plate processing. The ThermoFlexX TFxX 30 model, which can image smaller plate sizes up to 635 x 762mm (25 x 30”), can also be seen on the stand. Both imagers are compact and efficient solutions that deliver the highest quality flat-top dot plates at an impressive level of productivity, coupled with low cost of ownership and less waste.
In addition, XSYS will be highlighting its rotec® sleeve and adapter portfolio with a demonstration of the next evolution of Eco technology, the Eco Xtra Ring. The showcase will give visitors a chance to appreciate more closely the flexible rotec® options for improved sustainability and efficiency.
